ENIG-PREMIUM: SURFACE FINISH FOR BETTER RELIABILITY OF ELECTRONIC ASSEMBLIES

Date and Start Time: Tuesday, October 27, 2020 10:00 AM (Pacific Time)

Program Description:

Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. ENIG also suffers from brittle solder joint failures. Due to these reasons, there are field failures and reliability concerns of electronic assemblies - component disconnection which lead to overall malfunction of electronic assemblies. Moreover, most ENIG manufacturers/suppliers provide cyanide-based gold chemistry which has health and ecological hazards. The ENIG-Premium eliminates black pad- corrosion related issues, achieves robust solder joints and provides improved quality and reliability of electronic assembly. Also, it uses cyanide-free chemistry for the immersion gold process making it eco-friendly. This allows manufacturers to consume eco-friendly product while avoiding major field failures and resulting consequences.