This presentation focuses on solder paste flux, liquid flux and wire solder fluxes and how their usage and the ingredients can affect PCBAs. If no clean fluxes are partially cleaned then the flux ingredients can pose a risk similar to un-washed high activity water soluble fluxes. Rework of solder joints increases the intermetallic layer thickness which can lead to mechanical fractures. Voiding in solder joints can lead to failures due to over-heating and mechanical fractures. Recommendations to mitigate risk will be given in the form of best practices for use of solder pastes and fluxes.
Chemist / Field application