NI-LESS ENIG-PREMIUM: SURFACE FINISH FOR NEXT GENERATION PCB TECHNOLOGIES - 5G, HDI, RF-MICROWAVE, HIGH FREQUENCIES

Date and Start Time: Monday, June 8th, 2020 - 10:00 AM (Pacific Time)

Program Description:

The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovations in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance and signal loss. Among the primary factors affecting the integrity of high frequency signals is the surface finish applied on PCB copper pads – a need commonly met by technology manufacturers through the electroless nickel immersion gold process, ENIG. However, a well-documented limitation of ENIG is its insertion loss due to the inferior conductivity of nickel over   more

Kunal Shah
kunal.shah@lilotree.com

PhD. (PRESIDENT @ LILOTREE)

Speakers LinkedIn Page